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 APW7209
1MHz, High-Efficiency, Step-Up Converter for 2 to 10 White LEDs
Features
* * * * * * * * * * *
Wide Input Voltage from 2.5V to 6V 0.3V Reference Voltage Fixed 1MHz Switching Frequency High Efficiency up to 88% 100Hz to 100kHz PWM Brightness Control Frequency Open-LED Protection Under-Voltage Lockout Protection Over-Temperature Protection <1A Quiescent Current during Shutdown SOT-23-6 Package Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APW7209 is a current-mode and fixed frequency boost converter with an integrated N-FET to drive up to 10 white LEDs in series. The series connection allows the LED current to be identical for uniform brightness. Its low on-resistance of NFET and low feedback voltage reduce power loss and achieve high efficiency. Fast switching frequency(1MHz typical) allows using small-size inductor and both of input and output capacitors. An over voltage protection function, which monitors the output voltage via OVP pin, stops switching of the IC if the OVP voltage exceeds the over voltage threshold. An internal soft-start circuit eliminates the inrush current during start-up. The APW7209 also integrates under-voltage lockout, overtemperature protection, and current limit circuits to protect the IC in abnormal conditions.The APW7209 is available in a SOT-23-6 package.
Applications
* * * * White LED Display Backlighting Cell Phone and Smart Phone PDA, PMP, MP3 Digital Camera
Simplified Application Circuit
VIN
L1 22H
VOUT
Pin Configuration
SOT-23-6 Top View LX 1 GND 2 FB 3 6 VIN 5 OVP 4 EN
C1 4.7F
6 2 4
VIN GND EN
LX OVP FB
1 5 3
C2 1F
Up to 10 WLEDs
APW7209
OFF ON
R1 15
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 1 www.anpec.com.tw
APW7209
Ordering and Marking Information Package Code C : SOT-23-6 Operating Ambient Tempe Assembly MaterialI : to 85 rature Range -40 o C Handling Code H andling Code TR Temperature Range : Tape & Reel Assembly Material Package Code L : Lead Free Device G : Halogen and Lead Free Device X - Date Code W09X APW7209 CI: APW7209
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
Absolute Maximum Ratings
Symbol VIN VIN Supply Voltage (VIN to GND) FB, EN to GND Voltage VLX VOVP TJ TSTG TSDR LX to GND Voltage OVP to GND Voltage Maximum Junction Temperature Storage Temperature
(Note 1)
Parameter
Rating -0.3 ~ 7 -0.3 ~ VIN -0.3 ~ 42 -0.3 ~ 42 150 -65 ~ 150 260
Unit V V V V C C C
Maximum Lead Soldering Temperature, 10 Seconds
Note 1: Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics (Note 2)
Symbol JA Parameter Junction to Ambient Thermal Resistance. SOT-23-6 250 Typical Value Unit C/W
Note 2: JA is measured with the component mounted on a high effective thermal conductivity test board in free air.
Recommended Operating Conditions (Note 3)
Symbol VIN CIN COUT L1 TA TJ VIN Input Voltage Input Capacitor Output capacitor Inductor Ambient Temperature Junction Temperature Parameter Range 2.5~ 6 4.7 or higher 0.68 or higher 6.8 ~ 47 -40 ~ 85 -40 ~ 125 Unit V F F H C C
Note 3: Refer to the application circuit for further information.
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Electrical Characteristics
(Refer to figure 1 in the "Typical Application Circuits". These specifications apply over VIN = 3.6V, TA = -40C to 85C, unless otherwise noted. Typical values are at TA = 25C.)
Symbol Parameter Test Conditions APW7209 Min. Typ. Max. Unit
SUPPLY VOLTAGE AND CURRENT VIN IDD1 IDD2 ISD UNDER VOLTAGE LOCKOUT UVLO Threshold Voltage UVLO Hysteresis Voltage VIN Rising 2.0 50 2.2 100 2.4 150 V mV Input DC bias current Input Voltage Range TA = -40 ~ 85C, TJ = -40 ~ 125C VFB = 0.4V, no switching FB = GND, switching EN = GND 2.5 70 100 1 6 130 2 1 V A mA A
REFERENCE AND OUTPUT VOLTAGES VREF IFB FSW RON ILIM DMAX VOVP Regulated Feedback Voltage FB Input Current TA = 25C TA = -40 ~ 85C (TJ = -40 ~ 125C) 0.285 0.276 -50 0.3 0.315 0.324 50 V nA
INTERNAL POWER SWITCH Switching Frequency Power Switch On Resistance Power Switch Current Limit LX Leakage Current LX Maximum Duty Cycle VEN=0V, VLX=0V or 5V, VIN = 5V FB=GND 0.8 0.7 -1 92 1.0 0.6 0.9 95 1.2 1.2 1 98 MHz A A %
OUTPUT OVER VOLTAGE PROTECTION Over Voltage Threshold OVP Hysteresis OVP Leakage Current ENABLE AND SHUTDOWN VTEN ILEN TOTP EN Voltage Threshold EN Voltage Hysteresis EN Leakage Current Over-Temperature Protection (Note 4) VEN= 0~5V, VIN = 5V TJ Rising VEN Rising 0.4 -1 0.7 0.1 1 1 V V A VOVP =40V VOVP rising 40 3 50 V V A
OVER-TEMPERATURE PROTECTION 150 40 C C
Over-Temperature Protection Hysteresis (Note 4) Note 4: Guaranteed by design, not production tested.
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Typical Operating Characteristics
(Refer to figure 1 in the section "Typical Application Circuits", VIN=3.6V, TA=25oC, 10WLEDs unless otherwise specified)
Efficiency vs. WLED Current
95 90 85
E fficiency ()
WLED Current vs. PWM Duty Cycle
20 18
WLED Current, ILE (mA) D
16 14 12 10 8 6 4 2 0 100Hz 0 20 40 60 80 100 1KHz 100KHz
80 75 70 65 60 55 50 0 5 10 15 20 25 30 VIN=3.3V VIN=3.6V 10 WLEDs VIN=4.2V VIN=5V
33V@20mA
=POUT/PIN
, ()
PWM Duty Cycle (%)
WLED Current vs. Supply Voltage
21.0 M axim um Duty C ycle, D MAX (% ) 20.8
Maximum Duty Cycle vs. Supply Voltage
100 90 80 70 60
W LED C urrent, I LED (m A)
20.6 20.4 20.2 20.0 19.8 19.6 19.4 19.2 19.0 2.5 3 3.5 4 4.5 5 5.5 6
50 40 2.5 3 3.5 4 4.5 5
IN(V)
5.5
6
Supply Voltage, V
IN(V)
Supply Voltage, V
1.2
Switching Frequency vs. Supply Voltage
Switch O N Resistance, R ON ([)
0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0
Switch ON Resistance vs. Supply Voltage
S witching Frequency, F SW (M H z)
1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 2.5 3 3.5 4 4.5 5 5.5 6
2.5
3
3.5
4
4.5
5
5.5
6
Supply Voltage, V
IN(V)
Supply Voltage, V
IN(V)
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Operating Waveforms
(Refer to the application circuit in the section "Typical Application Circuits", VIN=3.6V, TA=25oC, 10WLEDs unless otherwise specified )
Start-up
Normal Operating Waveform
VEN 1 VOUT, 10V/Div 1
VLX, 20V/Div, DC
2 2 IIN, 0.2A/Div 3 10WLEDs, L=22H, VIN=3.6V, ILED=20mA
CH1: VEN 1V/Div, DC , CH2: VOUT10V/Div, DC , CH3: I IN 0.2A/Div, DC , Time: 0.5ms/Div
VOUT, 100mV/Div, AC
3
IL, 0.2A/Div 10WLEDs, L=22H, VIN=3.6V, ILED=20mA CH1: VLX 20V/Div, DC , CH2: VOUT100mV/Div, AC , CH3: IL, 0.2A/Div, DC Time: 500ns/Div
Open-LED Protection
VOUT, 10V/Div
1
CH1: V , 10V/Div, DC OUT Time: 20ms/Div
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Pin Description
PIN NO. 1 2 3 NAME LX GND FB FUNCTION Switch pin. Connect this pin to inductor/diode here. Power and signal ground pin. Feedback Pin. Reference voltage is 0.3V(typical). Connect this pin to cathode of the lowest LED and current-sense resistor (R1). Calculate resistor value according to R1=0.3V/ILED. Enable Control Input. Forcing this pin above 1.0V enables the device, or forcing this pin below 0.4V 4 5 6 EN OVP VIN to shut it down. In shutdown, all functions are disabled to decrease the supply current below 1A. Do not leave this pin floating. Over Voltage Protection Input Pin. OVP is connected to the output capacitor of the converter. Main Supply Pin. Must be closely decoupled to GND with a 4.7F or greater ceramic capacitor.
Block Diagram
VIN
EN
UVLO
OVP
LX
Gate Driver Control Logic
OverTemperature Protection Slope Compensation
Current limit
Current Sense Amplifier
ICMP Error Amplifier FB COMP EAMP VREF 0.3V
Oscillator
GND
Softstart
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Typical Application Circuits
VIN
L1 22H C1 4.7F 6 VIN LX 1 C2 1F
VOUT
2
Up to 10 WLEDs
GND
OVP
5
4 OFF ON
APW7209
EN FB 3 R1 15
Figure 1. Typical 10 WLEDs Application
VIN
C1 4.7F L1 22H 6 2 100Hz~100kHz 4 Duty=100%, ILED=20mA Duty=0%, LED off 1 C2 1F
VOUT
VIN
LX
Up to 10 WLEDs
GND
OVP
5
APW7209
EN FB 3 R1 15
Figure 2. Brightness control by using a PWM signal applied to EN
VIN
L1 22H
VOUT
C1 4.7F
6
VIN
LX
1
C2 1F
2
GND
OVP
5
Up to 10 WLEDs
OFF ON
4
APW7209
EN 3.3V FB 3 R3 100K R2 10K R1 15
PWM 0V brightness control Duty=100%, LED off Duty=0%, ILED=22mA
R2 = VREF
VADJ
R4 10K C3 0.1F
ILED,MAX R3 + VADJ,MIN - ILED,MIN R3 - VADJ,MAX VADJ,MAX ILED,MAX + VREF ILED,MIN - VADJ,MIN ILED,MIN - VREF ILED,MAX
,MIN
R1 =
R2 R2 V REF 1 + V ADJ - R3 R3 ILED ,MAX
Figure 3. Brightness control using a filtered PWM signal
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Function Description
Main Control Loop The APW7209 is a constant frequency current-mode switching regulator. During normal operation, the internal N-channel power MOSFET is turned on each cycle when the oscillator sets an internal RS latch and turned off when an internal comparator (ICMP) resets the latch. The peak inductor current at which ICMP resets the RS latch is controlled by the voltage on the COMP node, which is the output of the error amplifier (EAMP). An external current-sense resistor connected between cathode of the lowest LED and ground allows the EAMP to receive a current feedback voltage VFB at FB pin. When the LEDs voltage increases to cause the LEDs current to decrease, it causes a slightly decrease in VFB relative to the 0.3V reference, which in turn causes the COMP voltage to increase until the LEDs current reaches the set point. VIN Under-Voltage Lockout (UVLO) The Under-Voltage Lockout (UVLO) circuit compares the input voltage at VIN with the UVLO threshold (2.2V rising, typical) to ensure the input voltage is high enough for reliable operation. The 100mV (typ) hysteresis prevents supply transients from causing a restart. Once the input voltage exceeds the UVLO rising threshold, startup begins. When the input voltage falls below the UVLO falling threshold, the controller turns off the converter. Soft-Start The APW7209 has a built-in soft-start to control the Nchannel MOSFET current rise during start-up. During softstart, an internal ramp voltage, connected to one of the inverting inputs of the comoarator ICMP, raise up to replace the output voltage of error amplifier until the ramp voltage reaches the VCOMP. Current-Limit Protection The APW7209 monitors the inductor current, flowing through the N-channel MOSFET, and limits the current peak at current-limit level to prevent loads and the APW7209 from damages in overload conditions. Over-Temperature Protection (OTP) The over-temperature circuit limits the junction temperature of the APW7209. When the junction temperature exceeds 150 oC, a thermal sensor turns off the power MOSFET, allowing the device to cool. The thermal sensor allows the converter to start a soft-start process and regulate the LEDs current again after the junction temperature cools by 40oC. The OTP is designed with a 40oC hysteresis to lower the average Junction Temperature (TJ) during continuous thermal overload conditions, increasing the lifetime of the device. Enable/Shutdown Driving EN to ground places the APW7209 in shutdown mode. When in shutdown, the internal power MOSFET turns off, all internal circuitry shuts down and the quiescnet supply current reduces to 1A maximum. This pin also could be used as a digital input allowing brightness controlled by using a PWM signal with frequency from 100Hz to 100kHz. The 0% duty cycle of PWM signal corresponds to zero LEDs current and 100% corresponds to full one. Open-LED Protection In driving LED applications, the feedback voltage on FB pin falls down if one of the LEDs, in series, is failed. Meanwhile, the converter unceasingly boosts the output voltage like a open-loop operation. Therefore, an overvoltage protection (OVP), monitoring the output voltage via OVP pin, is integrated into the chip to prevent the LX and the output voltages from exceeding their maximum voltage ratings. When the voltage on the OVP pin rises above the OVP threshold (40V, typical), the converter stops switching and prevents the output voltage from rising. The converter can work again when the falling OVP voltage falls below the OVP voltage threshold.
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Application Information
Input Capacitor Selection The input capacitor (CIN) reduces the ripple of the input current drawn from the input supply and reduces noise injection into the IC. The reflected ripple voltage will be smaller when an input capacitor with larger capacitance is used. For reliable operation, it is recommended to select the capacitor with maximum voltage rating at least 1.2 times of the maximum input voltage. The capacitors should be placed close to the VIN and GND. Inductor Selection Selecting an inductor with low dc resistance reduces conduction losses and achieves high efficiency. The efficiency is moderated whilst using small chip inductor which operates with higher inductor core losses. Therefore, it is necessary to take further consideration while choosing an adequate inductor. Mainly, the inductor value determines the inductor ripple current: larger inductor value results in smaller inductor ripple current and lower conduction losses of the converter. However, larger inductor value generates slower load transient response. A reasonable design rule is to set the ripple current, IL, to be 30% to 50% of the maximum average inductor current, IL(AVG). The inductor value can be obtained as below,
V L IN V OUT VOUT - VIN x x F xI IL SW OUT (MAX ) IL (AVG )
2
The peak inductor current is calculated as the following equation: IPEAK = IIN(MAX ) +
IL
1 VIN (VOUT - VIN ) 2 VOUT L FSW
LX D1 IOUT VOUT
VIN
IIN
CIN
N-FET
ISW
ESR COUT
IL ILIM IPEAK IL IIN ISW
ID IOUT
Output Capacitor Selection The current-mode control scheme of the APW7209 allows the usage of tiny ceramic capacitors. The higher capacitor value provides good load transient response. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are recommended. If required, tantalum capacitors may be used as well. The output ripple is the sum of the voltages across the ESR and the ideal output capacitor. GVOUT = GVESR + GVCOUT VCOUT IOUT VOUT - VIN x COUT VOUT x FSW
where VIN = input voltage VOUT = output voltage FSW = switching frequency in MHz IOUT = maximum output current in amp. b = Efficiency IL /IL(AVG) = inductor ripple current/average current (0.3 to 0.5 typical) To avoid saturation of the inductor, the inductor should be rated at least for the maximum input current of the converter plus the inductor ripple current. The maximum input current is calculated as below:
IIN(MAX ) = IOUT (MAX ) x VOUT VIN x
9
VESR IPEAK x RESR where IPEAK is the peak inductor current.
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Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
APW7209
Application Information (Cont.)
Output Capacitor Selection (Cont.) For ceramic capacitor application, the output voltage ripple is dominated by the VCOUT. When choosing the input and output ceramic capacitors, the X5R or X7R with their good temperature and voltage characteristics are recommended. Diode Selection To achieve high efficiency, a Schottky diode must be used. The current rating of the diode must meet the peak current rating of the converter. Setting the LED Current In figure 1, the converter regulates the voltage on FB pin, connected with the cathod of the lowest LED and the current-sense resistor R1, at 0.3V (typical). Therefore, the current (ILED), flowing via the LEDs and the R1, is calculated by the following equation:
ILED = 0 .3 V R1
Recommended Inductor Selection
Designator Manufacturer L1 L1 GOTREND GOTREND Part Number GTSD-53-470 GTSD-32-220 Inductance (H) 47 22 Max DCR (ohm) 0.35 0.59 Saturation Current (A) 0.62 0.52 Dimensions L x W x H (mm3) 5 x 5 x 2.8 3.85 x 3.85 x 1.8
Recommended Capacitor Selection
Part Number Designator Manufacturer C1 Murata GRM188R60J475KE19 C2 Murata GRM21BR71H105KA12 Capacitance (F) 4.7 1.0 TC Code X5R X7R Rated Voltage (V) 6.3 50 Case size 0603 0805
Recommended Diode Selection
Designator Manufacturer D1 Zowie Part Number MSCD106 Maximum average forward rectified current (A) 1.0 Maximum repetitive peak reverse voltage (V) 60 Case size 0805
Layout Consideration
For all switching power supplies, the layout is an important step in the design; especially at high peak currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems and duty cycle jitter. 1. The input capacitor should be placed close to the VIN and GND. Connecting the capacitor with VIN and GND pins by short and wide tracks without using any vias for filtering and minimizing the input voltage ripple. 2. The inductor should be placed as close as possible to the LX pin to minimize length of the copper tracks as well as the noise coupling into other circuits. 3. Since the feedback pin and network is a high impedance circuit, the feedback network should be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground plane or track to minimize noise coupling into this circuit. 4. A star ground connection or ground plane minimizes ground shifts and noise is recommended.
Via To OVP L1 To Anode of WLEDs VOUT D1 C1 LX C2 VIN Via To VOUT R1 VEN
From Cathod of WLEDs
Refer to Fig. 1
Optimized APW7209 Layout
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Package Information
SOT-23-6
D e
SEE VIEW A E1 b e1 E
c
0.25 GAUGE PLANE SEATING PLANE VIEW A
0
A2 A1
A
L
S Y M B O L A A1 A2 b c D E E1 e e1 L 0
SOT-23-6 MILLIMETERS MIN. MAX. 1.45 0.00 0.90 0.30 0.08 2.70 2.60 1.40 0.95 BSC 1.90 BSC 0.30 0 0.60 8 0.012 0 0.15 1.30 0.50 0.22 3.10 3.00 1.80 0.000 0.035 0.012 0.003 0.106 0.102 0.055 0.037 BSC 0.075 BSC 0.024 8 MIN. INCHES MAX. 0.057 0.006 0.051 0.020 0.009 0.122 0.118 0.071
Note : 1. Follow JEDEC TO-178 AB. 2. Dimension D and E1 do not include mold flash, protrusions or gate burrs. Mold flash, protrusion or gate burrs shall not exceed 10 mil per side.
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Carrier Tape & Reel Dimensions
OD0 P0 P2 P1 A E1 F K0 B SECTION A-A T B0 A0 OD1 B A SECTION B-B
d
Application
A 178.0O 2.00
H 50 MIN. P1 4.0O .10 0
H A
T1
T1
C
d
D
W 8.0O .30 0 A0 3.20O .20 0
W
E1 1.75O .10 0 B0
F 3.5O .05 0 K0
8.4+2.00 13.0+0.50 1.5 MIN. 20.2 MIN. -0.00 -0.20 P2 2.0O .05 0 D0 1.5+0.10 -0.00 D1 1.0 MIN. T 0.6+0.00 -0.40
SOT-23-6
P0 4.0O .10 0
3.10O .20 1.50O .20 0 0
(mm)
Devices Per Unit
Package Type SOT-23-6 Unit Tape & Reel Quantity 3000
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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APW7209
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp Critical Zone TL to TP Ramp-up
TL
Temperature
tL Tsmax
Tsmin Ramp-down ts Preheat
25
t 25C to Peak
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78
Time
Description 245C, 5 sec 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Time 25C to Peak Temperature Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds 6C/second max. 6 minutes max. Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008 13 www.anpec.com.tw
APW7209
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures Package Thickness <2.5 mm 2.5 mm Volume mm <350
3
Volume mm 350
3
240 +0/-5C 225 +0/-5C
225 +0/-5C 225 +0/-5C
Table 2. Pb-free Process - Package Classification Reflow Temperatures Package Thickness Volume mm <350
3
Volume mm 350-2000
3
Volume mm >2000
3
<1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level.
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
Copyright (c) ANPEC Electronics Corp. Rev. A.3 - Jul., 2008
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